Schneider Electric Launches Comprehensive Liquid Cooling Solutions for AI and HPC, Powered by Motivair
Schneider Electric has introduced its complete suite of liquid cooling technologies, a significant step towards supporting the increasing demands of AI and high-performance computing (HPC) workloads in modern data centers. This launch follows Schneider Electric’s acquisition of Motivair in early 2025, integrating Motivair’s extensive experience in exascale computing with Schneider Electric’s global infrastructure expertise. This move aims to equip facilities across the globe, including those in Africa grappling with rising data demands, with advanced cooling capabilities crucial for next-generation AI applications.
Liquid Cooling Portfolio Details
The newly launched portfolio provides end-to-end liquid cooling solutions featuring several key components. These include Coolant Distribution Units (CDUs), ChilledDoor® Rear Door Heat Exchangers, Liquid-to-Air Heat Dissipation Units (HDU™), and Dynamic Cold Plates. Furthermore, the portfolio includes Chillers and Technology Cooling System (TCS) Loops, complemented by Schneider Electric’s existing AI-Ready infrastructure solutions. By pairing Schneider Electric’s robust supply chain, expertise in data center infrastructure, and software and services with Motivair’s 15+ years of experience, this comprehensive offering promises to deliver a new generation of advanced cooling solutions suitable for hyperscale, colocation, and high-density data centers.
In conclusion, Schneider Electric’s expanded liquid cooling portfolio, fueled by the Motivair acquisition, marks a critical advancement in data center technology. This offers a potent response to the escalating cooling demands of AI and HPC, paving the way for more efficient and sustainable data center operations globally, especially in rapidly growing tech markets like those in Africa. This launch promises to accelerate the development and deployment of AI technologies by addressing a critical infrastructure bottleneck.
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